Hermeticity Testing of MEMS and Microelectronic Packages - Couverture rigide

Costello, Suzanne; Desmulliez, Marc

Couverture rigide

ISBN 10 : 1608075273 ISBN 13 : 9781608075270

Editeur : Artech House Publishers, 2013

Synopsis

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.

A propos du livre

À propos de l?auteur

Marc P.Y. Desmulliez is the head of the research institute in sensors, signals, and systems at Heriot-Watt University. He earned his Ph.D. in electrical engineering from Heriot-Watt University. Suzanne Costello is a development scientist at MCS Ltd. She earned her Ph.D. in engineering from Heriot-Watt University.

Détails de l'édition

• Éditeur: Artech House Publishers
• Date d'édition: 2013
• Langue: anglais
• ISBN 10: 1608075273
• ISBN 13: 9781608075270
• Reliure: Relié
• Nombre de pages: 200
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible