The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.
Topics include:
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Vendeur : PBShop.store UK, Fairford, GLOS, Royaume-Uni
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Vendeur : Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlande
Etat : New. 2019. 7th Revised edition. Hardcover. . . . . . N° de réf. du vendeur V9781627082457
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Vendeur : Brook Bookstore On Demand, Napoli, NA, Italie
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Vendeur : moluna, Greven, Allemagne
Etat : New. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This new edition will help engineers improve their ability to verify, isolat. N° de réf. du vendeur 596457624
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Vendeur : Revaluation Books, Exeter, Royaume-Uni
Hardcover. Etat : Brand New. 7th revised edition edition. 705 pages. 11.18x8.74x1.26 inches. In Stock. N° de réf. du vendeur __162708245X
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Vendeur : Kennys Bookstore, Olney, MD, Etats-Unis
Etat : New. 2019. 7th Revised edition. Hardcover. . . . . . Books ship from the US and Ireland. N° de réf. du vendeur V9781627082457
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Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Buch. Etat : Neu. Neuware - The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.Topics include:Failure Analysis Process and Management-wafer, package, and board level failure analysis flow.Incoming Inspection Tools-optical, x-ray, and scanning acoustic microscopy.Fault Isolation-front and backside sample preparation, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermography, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT, and current imaging.Device and Circuit Characterization-scanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing.FIB Technique and Circuit Edit- FIB overview and advanced circuit edit for first silicon debug.Physical Analysis-deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron microscopy (TEM), and scanning probe microscopy.Memory FA-DRAM, semiconductor memory failure signature analysis.Special Applications-automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics.Fundamental Topics-integrated circuit testing, analog design, reliability, quality, and training.Seven new topics have been added and all themes covered in earlier editions are included in the Seventh Edition. Many previous articles have been updated. N° de réf. du vendeur 9781627082457
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Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
Etat : New. In English. N° de réf. du vendeur ria9781627082457_new
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Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
Hardcover. Etat : New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book. N° de réf. du vendeur ERICA754162708245X5
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