Microwave Power Amplifier Design With MMIC Modules - Couverture rigide

Hausman, Howard

Couverture rigide

ISBN 10 : 163081346X ISBN 13 : 9781630813468

Editeur : Artech House Publishers, 2018

Synopsis

This book offers engineers a practical guide to the best suited power amplifier modules for a particular application, and explores how to interface the selected module with other power amplifier modules in the system. It also explains how to identify and mitigate peripheral issues concerning the PA modules, SSPAs, and microwave systems. This volume presents the critical techniques and underpinnings of SSPA design, enabling professionals to optimize device and system performance. Solid state power amplifiers (SSPA) are a critical part of many microwave systems. Designing SSPAs with monolithic microwave integrated circuits (MMIC) has boosted device performance to much higher levels focused on PA modules. Engineers gain the knowledge they need to evaluate the optimum topologies for the design of a chain of microwave devices, including power amplifiers. Additionally, the book addresses the interface between the microwave subsystems and the primary DC power, the control and monitoring circuits, and the thermal and EMI paths. Packed with 240 illustrations and over 430 equations, this detailed book provides the practical tools engineers need for their challenging projects in the field.

A propos du livre

À propos de l'auteur

Howard Hausman is a senior principal engineer at L3-narda-MITEQ. He is also an adjunct professor at Hofstra University in the School of Engineering. He holds an M.S in electrical engineering from the NYU Tandon School of Engineering.

Détails de l'édition

• Éditeur: Artech House Publishers
• Date d'édition: 2018
• Langue: anglais
• ISBN 10: 163081346X
• ISBN 13: 9781630813468
• Reliure: Relié
• Nombre de pages: 280
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible