Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Couverture souple
Livre 50 sur 74: Springer Series in Advanced Manufacturing
Synopsis
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.
Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering (eng)
impression à la demandeVendeur : Brook Bookstore On Demand, Napoli, NA, Italie
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Etat : new. Questo è un articolo print on demand. N° de réf. du vendeur deb0315f6e103798a1d8e15805285ecf
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Edité par
Springer International Publishing Jan 2019, 2019
ISBN 10 : 3030085619
ISBN 13 : 9783030085612
Neuf
Taschenbuch
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. 124 pp. Englisch. N° de réf. du vendeur 9783030085612
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Edité par
Springer International Publishing, 2019
ISBN 10 : 3030085619
ISBN 13 : 9783030085612
Neuf
Couverture souple
Vendeur : moluna, Greven, Allemagne
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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Introduces a new and unique packaging technologyExplains microelectromechanical systems (MEMS) packaging utilizing polymers or thin filmsDiscusses finite element method (FEM) modeling to explain the technology from a theoretical perspective. N° de réf. du vendeur 448671572
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using . (Springer Series in Advanced Manufacturing)
Vendeur : Books Puddle, New York, NY, Etats-Unis
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Etat : New. Softcover reprint of the original 1st ed. 2018 edition NO-PA16APR2015-KAP. N° de réf. du vendeur 26376481562
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Edité par
Springer International Publishing, 2019
ISBN 10 : 3030085619
ISBN 13 : 9783030085612
Neuf
Taschenbuch
Vendeur : preigu, Osnabrück, Allemagne
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Taschenbuch. Etat : Neu. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method | Seonho Seok | Taschenbuch | viii | Englisch | 2019 | Springer International Publishing | EAN 9783030085612 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. N° de réf. du vendeur 116381282
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using . (Springer Series in Advanced Manufacturing)
impression à la demandeVendeur : Majestic Books, Hounslow, Royaume-Uni
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Etat : New. Print on Demand. N° de réf. du vendeur 369563845
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
ISBN 10 : 3030085619
ISBN 13 : 9783030085612
Neuf
Taschenbuch
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films ¿ a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load¿displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 124 pp. Englisch. N° de réf. du vendeur 9783030085612
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
ISBN 10 : 3030085619
ISBN 13 : 9783030085612
Neuf
Taschenbuch
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. N° de réf. du vendeur 9783030085612
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using . (Springer Series in Advanced Manufacturing)
impression à la demandeVendeur : Biblios, Frankfurt am main, HESSE, Allemagne
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Etat : New. PRINT ON DEMAND. N° de réf. du vendeur 18376481552
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Vendeur : Revaluation Books, Exeter, Royaume-Uni
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Paperback. Etat : Brand New. reprint edition. 124 pages. 9.25x6.10x0.28 inches. In Stock. N° de réf. du vendeur 3030085619
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