Articles liés à Systems-level Packaging for Millimeter-wave Transceivers
Synopsis
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
À propos de l?auteur
Mladen Bozanic (Ph.D, University of Pretoria), is a Senior IC Design Engineer responsible for mixed-mode design and design-for-test at Azoteq, South Africa and part-time researcher at the Department of Electrical and Electronic Engineering Science, University of Johannesburg. He is a Specialist Editor of South African Institute of Electrical Engineers (SAIEE) Africa Research Journal for the field of microelectronics and has authored or co-authored over 25 peer-reviewed contributions.
Prof Saurabh Sinha obtained his B.Eng, M.Eng, and Ph.D. degrees in Electronic Engineering from the University of Pretoria. As an established researcher, rated by the National Research Foundation (NRF), he has authored or co-authored over 110 publications in peer-reviewed journals and at international conferences. Prof Sinha is the Deputy Vice-Chancellor: Research and Internationalisation, University of Johannesburg. Prof Sinha served the 2014-2015 IEEE Board of Director and as IEEE Vice-President: Educational Activities.
Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.
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Systems-Level Packaging for Millimeter-Wave Transceivers.
Edité par
Cham, Springer., 2019
ISBN 10 : 3030146898
ISBN 13 : 9783030146894
Ancien ou d'occasion
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Vendeur : Universitätsbuchhandlung Herta Hold GmbH, Berlin, Allemagne
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XV, 277 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Smart Sensors, Measurement and Instrumentation, 34. Sprache: Englisch. N° de réf. du vendeur 9734GB
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Systems-Level Packaging for Millimeter-Wave Transceivers
Edité par
Springer International Publishing, 2019
ISBN 10 : 3030146898
ISBN 13 : 9783030146894
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Couverture rigide
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Systems-Level Packaging for Millimeter-Wave Transceivers
Edité par
Springer International Publishing, 2019
ISBN 10 : 3030146898
ISBN 13 : 9783030146894
Neuf
Couverture rigide
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers. N° de réf. du vendeur 9783030146894
Quantité disponible : 1 disponible(s)
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Systems-Level Packaging for Millimeter-Wave Transceivers
Edité par
Springer International Publishing Apr 2019, 2019
ISBN 10 : 3030146898
ISBN 13 : 9783030146894
Neuf
Couverture rigide
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers. 296 pp. Englisch. N° de réf. du vendeur 9783030146894
Quantité disponible : 2 disponible(s)
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Systems-Level Packaging for Millimeter-Wave Transceivers (Smart Sensors, Measurement and Instrumentation, 34)
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Systems-Level Packaging for Millimeter-Wave Transceivers
ISBN 10 : 3030146898
ISBN 13 : 9783030146894
Neuf
Couverture rigide
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. Neuware -This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 296 pp. Englisch. N° de réf. du vendeur 9783030146894
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Systems-level Packaging for Millimeter-wave Transceivers
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Systems-Level Packaging for Millimeter-Wave Transceivers (Smart Sensors, Measurement and Instrumentation, 34)
Vendeur : California Books, Miami, FL, Etats-Unis
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Systems-level Packaging for Millimeter-wave Transceivers
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Systems-level Packaging for Millimeter-wave Transceivers
Edité par
Springer, 2019
ISBN 10 : 3030146898
ISBN 13 : 9783030146894
Ancien ou d'occasion
Couverture rigide
Vendeur : GreatBookPrices, Columbia, MD, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Etat : As New. Unread book in perfect condition. N° de réf. du vendeur 35194609
Quantité disponible : Plus de 20 disponibles