Advanced Thermal Stress Analysis of Smart Materials and Structures - Couverture souple
Livre 11 sur 18: Structural Integrity
Synopsis
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.
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Advanced Thermal Stress Analysis of Smart Materials and Structures (eng)
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Etat : new. Questo è un articolo print on demand. N° de réf. du vendeur 8319902ade9a08557d84b83b76da8367
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Advanced Thermal Stress Analysis of Smart Materials and Structures: 10 (Structural Integrity)
Vendeur : Books Puddle, New York, NY, Etats-Unis
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Etat : New. pp. X, 304 104 illus., 44 illus. in color. 1st ed. 2020 edition NO-PA16APR2015-KAP. N° de réf. du vendeur 26384555142
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Advanced Thermal Stress Analysis of Smart Materials and Structures (Structural Integrity)
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Advanced Thermal Stress Analysis of Smart Materials and Structures
Edité par
Springer International Publishing Sep 2020, 2020
ISBN 10 : 3030252035
ISBN 13 : 9783030252038
Neuf
Taschenbuch
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware - This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with abrief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introducedthrough reviewing the methods for solving non-Fourier heat conduction theories and bypresenting transient heat transport in representative homogeneousand advanced heterogeneous materials. Thebook provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends withcoupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authorspropose directions for future research on the topic of multiphysical analysis of smart materials. 316 pp. Englisch. N° de réf. du vendeur 9783030252038
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Advanced Thermal Stress Analysis of Smart Materials and Structures
Edité par
Springer International Publishing, 2020
ISBN 10 : 3030252035
ISBN 13 : 9783030252038
Neuf
Couverture souple
Vendeur : moluna, Greven, Allemagne
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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A first monograph on thermal stress analysis based on non-Fourier heat conduction theoriesIncludes applications of non-Fourier heat conduction in thermal stress analysis of smart materials and structuresSummarizies non-Fourier heat co. N° de réf. du vendeur 448676713
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Advanced Thermal Stress Analysis of Smart Materials and Structures: 10 (Structural Integrity)
impression à la demandeVendeur : Majestic Books, Hounslow, Royaume-Uni
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Etat : New. Print on Demand pp. X, 304 104 illus., 44 illus. in color. N° de réf. du vendeur 379348825
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Advanced Thermal Stress Analysis of Smart Materials and Structures: 10 (Structural Integrity)
impression à la demandeVendeur : Biblios, Frankfurt am main, HESSE, Allemagne
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Etat : New. PRINT ON DEMAND pp. X, 304 104 illus., 44 illus. in color. N° de réf. du vendeur 18384555148
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Advanced Thermal Stress Analysis of Smart Materials and Structures
Vendeur : preigu, Osnabrück, Allemagne
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Taschenbuch. Etat : Neu. Advanced Thermal Stress Analysis of Smart Materials and Structures | Zengtao Chen (u. a.) | Taschenbuch | Structural Integrity | x | Englisch | 2020 | Springer | EAN 9783030252038 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. N° de réf. du vendeur 118986997
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Advanced Thermal Stress Analysis of Smart Materials and Structures
Edité par
Springer, Springer Sep 2020, 2020
ISBN 10 : 3030252035
ISBN 13 : 9783030252038
Neuf
Taschenbuch
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 316 pp. Englisch. N° de réf. du vendeur 9783030252038
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Advanced Thermal Stress Analysis of Smart Materials and Structures
Edité par
Springer International Publishing, 2020
ISBN 10 : 3030252035
ISBN 13 : 9783030252038
Neuf
Taschenbuch
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with abrief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introducedthrough reviewing the methods for solving non-Fourier heat conduction theories and bypresenting transient heat transport in representative homogeneousand advanced heterogeneous materials. Thebook provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends withcoupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authorspropose directions for future research on the topic of multiphysical analysis of smart materials. N° de réf. du vendeur 9783030252038
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EUR 106,99
Expédition à EUR 62,41
Expédition depuis Allemagne vers Etats-Unis
Expédition depuis Allemagne vers Etats-Unis
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