Interconnect Reliability in Advanced Memory Device Packaging - Couverture rigide

Livre 86 sur 90: Springer Series in Reliability Engineering

Gan, Chong Leong ; Huang, Chen-Yu

9783031267079: Interconnect Reliability in Advanced Memory Device Packaging

Couverture rigide

ISBN 10 : 3031267079 ISBN 13 : 9783031267079

Editeur : Springer International Publishing AG, 2023

Afficher les exemplaires de cette �dition comportant l'ISBN

0 D'occasion

11 Neuf

De EUR 90,89

This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.

In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.

This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Les informations fournies dans la section � Synopsis � peuvent faire r�f�rence � une autre �dition de ce titre.

�diteur: Springer International Publishing AG
Date d'�dition: 2023
Langue: anglais
ISBN 10: 3031267079
ISBN 13: 9783031267079
Reliure: Reli�
Nombre de pages: 228
Coordonn�es du fabricant: Springer Nature Customer Service Center GmbH
ProductSafety@springernature.com

Europaplatz 3
Heidelberg
69115
Allemagne

R�sultats de recherche pour Interconnect Reliability in Advanced Memory Device...

Image d'archives

Interconnect Reliability in Advanced Memory Device Packaging (Springer Series in Reliability Engineering) [Hardcover] [Apr 29, 2023] Gan, Chong Leong and Huang, Chen-Yu

Gan, Chong Leong; Huang, Chen-Yu

Edit� par Springer, 2023

ISBN 10 : 3031267079 ISBN 13 : 9783031267079

Neuf Couverture rigide

Vendeur : StainesBookhub, Weybridge, SURRE, Royaume-Uni

�valuation du vendeur 2 sur 5 �toiles

Etat : New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage. N� de r�f. du vendeur SPRINGERNEW12091

Contacter le vendeur

Acheter neuf

EUR 90,89

Exp�dition �EUR 35,51
Exp�dition depuis Royaume-Uni vers Etats-Unis

Quantit� disponible : 1 disponible(s)

Ajouter au panier

Image d'archives

Interconnect Reliability in Advanced Memory Device Packaging (eng)

Gan, Chong Leong

Edit� par Springer, 2023

ISBN 10 : 3031267079 ISBN 13 : 9783031267079

Neuf Couverture rigide

impression � la demande

Vendeur : Brook Bookstore On Demand, Napoli, NA, Italie

�valuation du vendeur 5 sur 5 �toiles

Etat : new. Questo � un articolo print on demand. N� de r�f. du vendeur UWANX7LXUA

Contacter le vendeur

Acheter neuf

EUR 166,29

Exp�dition �EUR 6,80
Exp�dition depuis Italie vers Etats-Unis

Quantit� disponible : Plus de 20 disponibles

Ajouter au panier

Image fournie par le vendeur

Interconnect Reliability in Advanced Memory Device Packaging

Gan, Chong Leong,|Huang, Chen-Yu,

Edit� par Springer, Berlin|Springer International Publishing|Springer, 2023

ISBN 10 : 3031267079 ISBN 13 : 9783031267079

Neuf Couverture rigide

impression � la demande

Vendeur : moluna, Greven, Allemagne

�valuation du vendeur 5 sur 5 �toiles

Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the rel. N� de r�f. du vendeur 799921343

Contacter le vendeur

Acheter neuf

EUR 180,07

Exp�dition �EUR 48,99
Exp�dition depuis Allemagne vers Etats-Unis

Quantit� disponible : Plus de 20 disponibles

Ajouter au panier

Image fournie par le vendeur

Interconnect Reliability in Advanced Memory Device Packaging

Chen-Yu Huang

Edit� par Springer International Publishing Apr 2023, 2023

ISBN 10 : 3031267079 ISBN 13 : 9783031267079

Neuf Couverture rigide

impression � la demande

Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne

�valuation du vendeur 5 sur 5 �toiles

Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. 228 pp. Englisch. N� de r�f. du vendeur 9783031267079

Contacter le vendeur

Acheter neuf

EUR 213,99

Exp�dition �EUR 23
Exp�dition depuis Allemagne vers Etats-Unis

Quantit� disponible : 2 disponible(s)

Ajouter au panier

Image d'archives

Interconnect Reliability in Advanced Memory Device Packaging (Hardcover)

Chong Leong, Gan

Edit� par Springer International Publishing AG, Cham, 2023

ISBN 10 : 3031267079 ISBN 13 : 9783031267079

Neuf Couverture rigide

Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-Unis

�valuation du vendeur 5 sur 5 �toiles

Hardcover. Etat : new. Hardcover. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N� de r�f. du vendeur 9783031267079

Contacter le vendeur

Acheter neuf

EUR 251,87

Livraison gratuite
Exp�dition nationale�: Etats-Unis

Quantit� disponible : 1 disponible(s)

Ajouter au panier

Image fournie par le vendeur

Interconnect Reliability in Advanced Memory Device Packaging

Chen-Yu Huang

Edit� par Springer International Publishing, Springer Nature Switzerland Apr 2023, 2023

ISBN 10 : 3031267079 ISBN 13 : 9783031267079

Neuf Couverture rigide

impression � la demande

Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne

�valuation du vendeur 5 sur 5 �toiles

Buch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 228 pp. Englisch. N� de r�f. du vendeur 9783031267079

Contacter le vendeur

Acheter neuf

EUR 213,99

Exp�dition �EUR 60
Exp�dition depuis Allemagne vers Etats-Unis

Quantit� disponible : 1 disponible(s)

Ajouter au panier

Image fournie par le vendeur

Interconnect Reliability in Advanced Memory Device Packaging

Chong Leong Gan

Edit� par Springer, 2023

ISBN 10 : 3031267079 ISBN 13 : 9783031267079

Neuf Couverture rigide

Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne

�valuation du vendeur 5 sur 5 �toiles

Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. N� de r�f. du vendeur 9783031267079

Contacter le vendeur