Interconnect Reliability in Advanced Memory Device Packaging - Couverture souple

Livre 86 sur 90: Springer Series in Reliability Engineering

Gan, Chong Leong ; Huang, Chen-Yu

9783031267109: Interconnect Reliability in Advanced Memory Device Packaging

Couverture souple

ISBN 10 : 3031267109 ISBN 13 : 9783031267109

Editeur : Springer International Publishing AG, 2024

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This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.

In the past 40 years, memory packaging processes have evolved enormously.

Les informations fournies dans la section � Synopsis � peuvent faire r�f�rence � une autre �dition de ce titre.

�diteur: Springer International Publishing AG
Date d'�dition: 2024
Langue: anglais
ISBN 10: 3031267109
ISBN 13: 9783031267109
Reliure: Broch�
Nombre de pages: 228
Coordonn�es du fabricant: ProductSafety@springernature.com
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Interconnect Reliability in Advanced Memory Device Packaging (eng)

Gan, Chong Leong

Edit� par Springer, 2024

ISBN 10 : 3031267109 ISBN 13 : 9783031267109

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Interconnect Reliability in Advanced Memory Device Packaging

Gan, Chong Leong,|Huang, Chen-Yu,

Edit� par Springer, Berlin|Springer International Publishing|Springer, 2024

ISBN 10 : 3031267109 ISBN 13 : 9783031267109

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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the rel. N� de r�f. du vendeur 1602275932

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Interconnect Reliability in Advanced Memory Device Packaging

Chen-Yu Huang

Edit� par Springer International Publishing Mai 2023, 2023

ISBN 10 : 3031267109 ISBN 13 : 9783031267109

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware 228 pp. Englisch. N� de r�f. du vendeur 9783031267109

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Interconnect Reliability in Advanced Memory Device Packaging

Chen-Yu Huang

Edit� par Springer Nature Switzerland Apr 2024, 2024

ISBN 10 : 3031267109 ISBN 13 : 9783031267109

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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 228 pp. Englisch. N� de r�f. du vendeur 9783031267109

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Interconnect Reliability in Advanced Memory Device Packaging

Chen-Yu Huang

Edit� par Springer International Publishing, 2024

ISBN 10 : 3031267109 ISBN 13 : 9783031267109

Neuf Taschenbuch

Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne

�valuation du vendeur 5 sur 5 �toiles

Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. N� de r�f. du vendeur 9783031267109

Contacter le vendeur