4th International Conference on Electronics and Signal Processing: Icesp 2023 - Couverture rigide

Couverture rigide

ISBN 10 : 3031366697 ISBN 13 : 9783031366697

Editeur : Springer International Publishing AG, 2023

Synopsis

This book presents the proceedings of the 4th International Conference on Electronics and Signal Processing (ICESP 2023), which was held in Macau, China during January 13-15, 2023. The book consists of contributions from various authors from both academia and industry, focusing on a diverse aspect of signal processing and information communication systems. The published papers suggest cutting-edge solutions that contribute to the quest for the future applications and communicating systems. The book is a useful reference to research students, research fellows, and scientists and engineers in the corresponding fields.

A propos du livre

À propos de l?auteur

Seokwon Yeom has been a faculty member of Daegu University since 2007. He is now a full professor of the same university, School of AI. He has a Ph.D. in Electrical and Computer Engineering from the University of Connecticut in 2006. His research interests are intelligent image/optical information processing, deep/machine learning, and target tracking. He has researched on multiple target tracking for the airborne early warning system, three-dimensional image processing with digital holography and integral imaging, photon-counting linear discriminant analysis and photon-counting nonlinear matched filter, millimeter wave and infrared image analysis, and long-distance target tracking for aerial surveillance and search and rescue mission with a small unmanned aerial vehicle. He has been a guest editor of Applied Sciences and Drones in MDPI. He has served as a board member of the Korean Institute of Intelligent Systems, and a member of the board of directors of the Korean Institute of Convergence Signal Processing. He was program chair of ICCCS2015, ISIS2017, iFUZZY2018, ICCCS2019, ADIP2021-2023, IPMV2024. He was a vice director of the AI homecare center and a head of the department of IT convergence engineering at Daegu University in 2020, a visiting scholar at the University of Maryland in 2014, and a director of the Gyeongbuk techno-park specialization center in 2013.

Détails de l'édition

• Éditeur: Springer International Publishing AG
• Date d'édition: 2023
• Langue: anglais
• ISBN 10: 3031366697
• ISBN 13: 9783031366697
• Reliure: Relié
• Nombre de pages: 122
• Éditeur: Yeom Seokwon
• Coordonnées du fabricant: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Allemagne