4th International Conference on Electronics and Signal Processing: ICESP 2023 - Couverture souple

Couverture souple

ISBN 10 : 3031366727 ISBN 13 : 9783031366727

Editeur : Springer, 2024

Synopsis

This book presents the proceedings of the 4th International Conference on Electronics and Signal Processing (ICESP 2023), which was held in Macau, China during January 13-15, 2023. The book consists of contributions from various authors from both academia and industry, focusing on a diverse aspect of signal processing and information communication systems. The published papers suggest cutting-edge solutions that contribute to the quest for the future applications and communicating systems. The book is a useful reference to research students, research fellows, and scientists and engineers in the corresponding fields.

A propos du livre

À propos de l?auteur

Seokwon Yeom has been a faculty member of Daegu University since 2007. He is now a full professor of the same university, School of AI. He has a Ph.D. in Electrical and Computer Engineering from the University of Connecticut in 2006. His research interests are intelligent image/optical information processing, deep/machine learning, and target tracking. He has researched on multiple target tracking for the airborne early warning system, three-dimensional image processing with digital holography and integral imaging, photon-counting linear discriminant analysis and photon-counting nonlinear matched filter, millimeter wave and infrared image analysis, and long-distance target tracking for aerial surveillance and search and rescue mission with a small unmanned aerial vehicle. He has been a guest editor of Applied Sciences and Drones in MDPI. He has served as a board member of the Korean Institute of Intelligent Systems, and a member of the board of directors of the Korean Institute of Convergence Signal Processing. He was program chair of ICCCS2015, ISIS2017, iFUZZY2018, ICCCS2019, ADIP2021-2023, IPMV2024. He was a vice director of the AI homecare center and a head of the department of IT convergence engineering at Daegu University in 2020, a visiting scholar at the University of Maryland in 2014, and a director of the Gyeongbuk techno-park specialization center in 2013.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2024
• Langue: anglais
• ISBN 10: 3031366727
• ISBN 13: 9783031366727
• Reliure: Broché
• Nombre de pages: 124
• Éditeur: Yeom Seokwon
• Coordonnées du fabricant: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Allemagne