Heterogeneous Soc Design and Verification: Hw/Sw Co-exploration, Co-design, Co-verification and Co-debugging - Couverture rigide

Mohamed, Khaled Salah

 
9783031561511: Heterogeneous Soc Design and Verification: Hw/Sw Co-exploration, Co-design, Co-verification and Co-debugging
Couverture rigide
ISBN 10 : 3031561511 ISBN 13 : 9783031561511
Editeur : Springer International Publishing AG, 2024

Synopsis

This book covers the foundations of hardware/software codesign, on-chip communication, debugging, and verification, for heterogenous SoCs. Its primary objective is to empower designers in making informed decisions, guiding them to strike the perfect balance between flexibility and performance for their SoC designs. Readers will benefit from a detailed exploration of the essential elements of the hardware and software codesign framework, accompanied by a discussion of the driving motivations behind this approach. The author also provides an in-depth review of various hardware design architectures, shedding light on different design possibilities. Furthermore, the book presents key concepts concerning hardware and software communication, unraveling the intricate interactions within an SoC. This book provides a holistic introduction to the methodologies underpinning SoC design and verification, making it an indispensable companion for both novice and experienced designers navigating the ever-evolving landscape of hardware/software codesign.

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À propos de l?auteur

Khaled Salah Mohamed attended the school of engineering, Department of Electronics and Communications at Ain-Shams University from 1998 to 2003, where he received his B.Sc. degree in Electronics and Communications Engineering with distinction and honors. He received his Masters degree in Electronics from Cairo University, Egypt in 2008. He received his PhD degree in 2012. Dr. Khaled Salah is currently a Sr. Applications Engineering Consultant for Siemens Digital Industries Software, in Fremont, CA. Dr. Khaled Salah has published a large number of papers in in the top refereed journals and conferences. His research interests are in 3D integration, IP Modeling, and SoC design.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Springer International Publishing AG
Date d'édition
2024
Langue
anglais
ISBN 10 
3031561511
ISBN 13 
9783031561511
Reliure
Relié
Nombre de pages
179
Coordonnées du fabricant
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