Articles liés à Electronic Materials Innovations and Reliability in...
Synopsis
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Résultats de recherche pour Electronic Materials Innovations and Reliability in...
Image d'archives
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
Edité par
Springer, Berlin, Springer, 2026
ISBN 10 : 3031947975
ISBN 13 : 9783031947971
Neuf
Taschenbuch
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level. 178 pp. Englisch. N° de réf. du vendeur 9783031947971
Acheter neuf
EUR 171,19
Expédition à EUR 23
Expédition depuis Allemagne vers Etats-Unis
Expédition depuis Allemagne vers Etats-Unis
Quantité disponible : 2 disponible(s)
Image fournie par le vendeur
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
Vendeur : preigu, Osnabrück, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. Electronic Materials Innovations and Reliability in Advanced Memory Packaging | Chong Leong Gan (u. a.) | Taschenbuch | Springer Series in Reliability Engineering | xv | Englisch | 2026 | Springer | EAN 9783031947971 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. N° de réf. du vendeur 136132551
Acheter neuf
EUR 149,10
Expédition à EUR 70
Expédition depuis Allemagne vers Etats-Unis
Expédition depuis Allemagne vers Etats-Unis
Quantité disponible : 5 disponible(s)
Image fournie par le vendeur
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
impression à la demandeVendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 196 pp. Englisch. N° de réf. du vendeur 9783031947971
Acheter neuf
EUR 171,19
Expédition à EUR 60
Expédition depuis Allemagne vers Etats-Unis
Expédition depuis Allemagne vers Etats-Unis
Quantité disponible : 1 disponible(s)
Image fournie par le vendeur
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level. N° de réf. du vendeur 9783031947971
Acheter neuf
EUR 237,67
Expédition à EUR 30,50
Expédition depuis Allemagne vers Etats-Unis
Expédition depuis Allemagne vers Etats-Unis
Quantité disponible : 1 disponible(s)