Insights into Semiconductor Technologies: Transistor, Interconnect, Packaging, Lithography and Memory - Couverture rigide

Tu, Yuan

Couverture rigide

ISBN 10 : 3032039991 ISBN 13 : 9783032039996

Editeur : Springer Nature Switzerland AG, 2026

Synopsis

This book explores the technological advancements in semiconductors through several key aspects: transistor, interconnect, lithography, packaging, and memory. By blending together the history and technological progress with interesting stories, and avoiding complex physics or formulas, the book aims to spark the interest of a diverse group of readers, encouraging them to enter this exciting industry. Additionally, it seeks to broaden the horizons of engineers who are currently focused on narrow areas of the field, offering them a more comprehensive perspective on the industry's vast scope and potential.

A propos du livre

À propos de l'auteur

Yuan Tu obtained his bachelor's degree from Wuhan University in China, and holds a Ph.D. degree from Tohoku University in Japan. Afterwards he pursued his postdoctoral research at Chinese Academy of Sciences, and subsequently the Interuniversity Microelectronics Centre (IMEC) in Belgium. His expertise is semiconductor materials and devices characterization with advanced microscopic techniques, including electron microscopy, scanning probe microscopy and atom probe tomography.  He co-founded AtomSolve, a platform dedicated to materials and devices analysis, with the aim of advancing research and development in emerging materials and devices.

Détails de l'édition

• Éditeur: Springer Nature Switzerland AG
• Date d'édition: 2026
• Langue: anglais
• ISBN 10: 3032039991
• ISBN 13: 9783032039996
• Reliure: Relié
• Nombre de pages: 227
• Coordonnées du fabricant: GPSR Kontakt; ProductSafety@springernature.com; ; Slevogtstraße 3-5; Heidelberg; 69126; Allemagne