Integrated Circuits and Systems for Smart Sensory Applications - Couverture rigide

Couverture rigide

ISBN 10 : 3036532641 ISBN 13 : 9783036532646

Editeur : Mdpi AG, 2022

Synopsis

Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware.

Détails de l'édition

• Éditeur: Mdpi AG
• Date d'édition: 2022
• Langue: anglais
• ISBN 10: 3036532641
• ISBN 13: 9783036532646
• Reliure: Relié
• Nombre de pages: 208
• Éditeur: Serra-Graells Francesc, Dei Michele, Cho Kyoungrok
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible