MEMS Packaging Technologies and 3D Integration - Couverture rigide

 
9783036542584: MEMS Packaging Technologies and 3D Integration

Synopsis

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

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