Molecular Modeling and Multiscaling Issues for Electronic Material Applications: Volume 2 - Couverture souple

Couverture souple

ISBN 10 : 3319366661 ISBN 13 : 9783319366661

Editeur : Springer, 2016

Synopsis

This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2016
• Langue: anglais
• ISBN 10: 3319366661
• ISBN 13: 9783319366661
• Reliure: Broché
• Nombre de pages: 204
• Éditeur: Wymyslowski Artur, Iwamoto Nancy, Yuen Matthew, Fan Haibo
• Coordonnées du fabricant: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Allemagne