Fundamentals of Electromigration-Aware Integrated Circuit Design - Couverture rigide

Lienig

Couverture rigide

ISBN 10 : 3319735578 ISBN 13 : 9783319735573

Editeur : Springer, 2018

Synopsis

The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.

A propos du livre

À propos de l?auteur

Jens Lienig is the director of the Institute of Electromechanical and Electronic Design at Dresden University of Technology, Germany. He received his Ph.D. in the field of computer-aided physical design of multi-chip modules and was employed as a researcher at University of Virginia, Charlottesville and Concordia University, Montreal. Afterwards he worked as project manager at Tanner Research, Inc. and Robert Bosch GmbH. His main research subjects are design of electronic systems and electronic design automation. He is a member of IEEE.

Matthias Thiele is a scientific assistant at Dresden University of Technology, Germany. He received his Ph.D. in the field of electromigration. Currently he works on the reliability of electronic and mechatronic systems.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2018
• Langue: anglais
• ISBN 10: 3319735578
• ISBN 13: 9783319735573
• Reliure: Relié
• Nombre de pages: 176
• Coordonnées du fabricant: non disponible
• Personne responsable: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Allemagne