Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Couverture rigide
Synopsis
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.
Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Edité par
Berlin Springer International Publishing Springer Mai 2018, 2018
ISBN 10 : 3319778714
ISBN 13 : 9783319778716
Neuf
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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
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Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. 115 pp. Englisch. N° de réf. du vendeur 9783319778716
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Edité par
Springer International Publishing, 2018
ISBN 10 : 3319778714
ISBN 13 : 9783319778716
Neuf
Couverture rigide
Vendeur : moluna, Greven, Allemagne
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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Introduces a new and unique packaging technologyExplains microelectromechanical systems (MEMS) packaging utilizing polymers or thin filmsDiscusses finite element method (FEM) modeling to explain the technology from a theoretical perspective. N° de réf. du vendeur 220289808
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Vendeur : Books Puddle, New York, NY, Etats-Unis
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Edité par
Springer, Berlin, Springer International Publishing, Springer, 2018
ISBN 10 : 3319778714
ISBN 13 : 9783319778716
Neuf
Couverture rigide
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. N° de réf. du vendeur 9783319778716
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
impression à la demandeVendeur : Majestic Books, Hounslow, Royaume-Uni
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Etat : New. Print on Demand. N° de réf. du vendeur 369569361
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
impression à la demandeVendeur : Biblios, Frankfurt am main, HESSE, Allemagne
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Etat : New. PRINT ON DEMAND. N° de réf. du vendeur 18376476036
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