Heat Transfer in Electronic Components - Couverture souple

Ponnusamy, Selvakumar ; Sivan, Suresh

9783330002210: Heat Transfer in Electronic Components

Couverture souple

ISBN 10 : 3330002212 ISBN 13 : 9783330002210

Editeur : LAP LAMBERT Academic Publishing, 2017

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This research monograph entitled - Heat Transfer in Electronic Components – is a concise book written based on a research work done at Nanotechnology Research Laboratory, Department of Mechanical Engineering, National Institute of Technology, Tiruchirappalli, Tamil Nadu, India. It presents heat transfer in electronic components cooling and nanofluids are used as coolant. This work presents a way to use liquids and particularly nanofluids as coolant for enhancing the heat transfer in electronic components with high end capabilities.

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�diteur: LAP LAMBERT Academic Publishing
Date d'�dition: 2017
Langue: anglais
ISBN 10: 3330002212
ISBN 13: 9783330002210
Reliure: Broch�
Nombre de pages: 136
Coordonn�es du fabricant: non disponible
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Heat Transfer in Electronic Components

Selvakumar Ponnusamy

Edit� par LAP LAMBERT Academic Publishing Feb 2017, 2017

ISBN 10 : 3330002212 ISBN 13 : 9783330002210

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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This research monograph entitled - Heat Transfer in Electronic Components - is a concise book written based on a research work done at Nanotechnology Research Laboratory, Department of Mechanical Engineering, National Institute of Technology, Tiruchirappalli, Tamil Nadu, India. It presents heat transfer in electronic components cooling and nanofluids are used as coolant. This work presents a way to use liquids and particularly nanofluids as coolant for enhancing the heat transfer in electronic components with high end capabilities. 136 pp. Englisch. N� de r�f. du vendeur 9783330002210

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Heat Transfer in Electronic Components

Selvakumar Ponnusamy|Suresh Sivan

Edit� par LAP LAMBERT Academic Publishing, 2017

ISBN 10 : 3330002212 ISBN 13 : 9783330002210

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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Ponnusamy SelvakumarDr. P. Selvakumar is a Professor and Dean in the Faculty of Mechanical Engineering at PSN College of Engineering and Technology which is an autonomous institution affiliated to Anna University. He is a recipient o. N� de r�f. du vendeur 159137042

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Heat Transfer in Electronic Components

Suresh Sivan

Edit� par LAP LAMBERT Academic Publishing, 2017

ISBN 10 : 3330002212 ISBN 13 : 9783330002210

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Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne

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Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This research monograph entitled - Heat Transfer in Electronic Components - is a concise book written based on a research work done at Nanotechnology Research Laboratory, Department of Mechanical Engineering, National Institute of Technology, Tiruchirappalli, Tamil Nadu, India. It presents heat transfer in electronic components cooling and nanofluids are used as coolant. This work presents a way to use liquids and particularly nanofluids as coolant for enhancing the heat transfer in electronic components with high end capabilities. N� de r�f. du vendeur 9783330002210

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Heat Transfer in Electronic Components

Selvakumar Ponnusamy

Edit� par LAP LAMBERT Academic Publishing Feb 2017, 2017

ISBN 10 : 3330002212 ISBN 13 : 9783330002210

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Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne

�valuation du vendeur 5 sur 5 �toiles

Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This research monograph entitled - Heat Transfer in Electronic Components - is a concise book written based on a research work done at Nanotechnology Research Laboratory, Department of Mechanical Engineering, National Institute of Technology, Tiruchirappalli, Tamil Nadu, India. It presents heat transfer in electronic components cooling and nanofluids are used as coolant. This work presents a way to use liquids and particularly nanofluids as coolant for enhancing the heat transfer in electronic components with high end capabilities.VDM Verlag, Dudweiler Landstra�e 99, 66123 Saarbr�cken 136 pp. Englisch. N� de r�f. du vendeur 9783330002210

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