Due to the aggressive scaling in the IC design, interconnect delay has adversely been affected, which subsequently reduces the performance. This problem can be mitigated by employing line drivers but they have high power consumption. Low-swing signalling techniques can provide high-speed signalling with low-power consumption, and most schemes are immune to noise as they have good signal-to-noise-ratio (SNR). However, they tend to have large area penalty and complexity as they require additional circuitry. A diode-connected driver circuit has the best attributes over other drivers in terms of low power, low delay, good SNR and low area-overhead. By incorporating a diode-connected configuration at the output, it can provide a high-speed signalling due to its high-driving capability. However, this configuration also has its limitations due to its inept adaptability to process variations, as well as leakage currents. To address these limitations, two novel driver schemes have been designed, where they have significant improvement in terms of delay, power consumption, noise and robustness against PVT effect and external disturbances such as crosstalk and single-event-upsets.
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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Due to the aggressive scaling in the IC design, interconnect delay has adversely been affected, which subsequently reduces the performance. This problem can be mitigated by employing line drivers but they have high power consumption. Low-swing signalling techniques can provide high-speed signalling with low-power consumption, and most schemes are immune to noise as they have good signal-to-noise-ratio (SNR). However, they tend to have large area penalty and complexity as they require additional circuitry. A diode-connected driver circuit has the best attributes over other drivers in terms of low power, low delay, good SNR and low area-overhead. By incorporating a diode-connected configuration at the output, it can provide a high-speed signalling due to its high-driving capability. However, this configuration also has its limitations due to its inept adaptability to process variations, as well as leakage currents. To address these limitations, two novel driver schemes have been designed, where they have significant improvement in terms of delay, power consumption, noise and robustness against PVT effect and external disturbances such as crosstalk and single-event-upsets. 220 pp. Englisch. N° de réf. du vendeur 9783330032460
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Vendeur : moluna, Greven, Allemagne
Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Mahyuddin Nor MuzlifahNor M. Muzlifah received B.Eng. degree in Electric-Telecommunication from Universiti Teknologi Malaysia, in 2005 M.Sc. degree in Electronics System Design Engineering from Universiti Sains Malaysia, in 2006 an. N° de réf. du vendeur 158421925
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Vendeur : Books Puddle, Woodside, NY, Etats-Unis
Etat : New. N° de réf. du vendeur 26394682600
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Vendeur : Majestic Books, Hounslow, Royaume-Uni
Etat : New. Print on Demand. N° de réf. du vendeur 401727287
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Vendeur : Biblios, Frankfurt am main, HESSE, Allemagne
Etat : New. PRINT ON DEMAND. N° de réf. du vendeur 18394682594
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Vendeur : Revaluation Books, Exeter, Royaume-Uni
Paperback. Etat : Brand New. 01 edition. 220 pages. 8.66x5.91x0.50 inches. In Stock. N° de réf. du vendeur 3330032464
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Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Due to the aggressive scaling in the IC design, interconnect delay has adversely been affected, which subsequently reduces the performance. This problem can be mitigated by employing line drivers but they have high power consumption. Low-swing signalling techniques can provide high-speed signalling with low-power consumption, and most schemes are immune to noise as they have good signal-to-noise-ratio (SNR). However, they tend to have large area penalty and complexity as they require additional circuitry. A diode-connected driver circuit has the best attributes over other drivers in terms of low power, low delay, good SNR and low area-overhead. By incorporating a diode-connected configuration at the output, it can provide a high-speed signalling due to its high-driving capability. However, this configuration also has its limitations due to its inept adaptability to process variations, as well as leakage currents. To address these limitations, two novel driver schemes have been designed, where they have significant improvement in terms of delay, power consumption, noise and robustness against PVT effect and external disturbances such as crosstalk and single-event-upsets.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 220 pp. Englisch. N° de réf. du vendeur 9783330032460
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Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Due to the aggressive scaling in the IC design, interconnect delay has adversely been affected, which subsequently reduces the performance. This problem can be mitigated by employing line drivers but they have high power consumption. Low-swing signalling techniques can provide high-speed signalling with low-power consumption, and most schemes are immune to noise as they have good signal-to-noise-ratio (SNR). However, they tend to have large area penalty and complexity as they require additional circuitry. A diode-connected driver circuit has the best attributes over other drivers in terms of low power, low delay, good SNR and low area-overhead. By incorporating a diode-connected configuration at the output, it can provide a high-speed signalling due to its high-driving capability. However, this configuration also has its limitations due to its inept adaptability to process variations, as well as leakage currents. To address these limitations, two novel driver schemes have been designed, where they have significant improvement in terms of delay, power consumption, noise and robustness against PVT effect and external disturbances such as crosstalk and single-event-upsets. N° de réf. du vendeur 9783330032460
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Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
paperback. Etat : New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book. N° de réf. du vendeur ERICA82933300324646
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