Reliability and Failure Analysis of Novel Lead-free Solders - Couverture souple

Tao, QuangBang

9783330046474: Reliability and Failure Analysis of Novel Lead-free Solders

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ISBN 10 : 3330046473 ISBN 13 : 9783330046474

Editeur : LAP LAMBERT Academic Publishing, 2017

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Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment, developing novel Pb-free solders becomes a real challenge for many industrials in recent years. Mechanical properties of the lead-free alloys are very important factors in the design and reliability evaluation of the soldered joints. Nowadays, among the newly-developed lead-free solder alloys, SAC-Bi,Ni,Sb (InnoLot) alloy, which contains minor quantities of Sb, Bi and Ni, have been identified as promising candidates for the automotive industry. In operation, the microstructure, mechanical response, and failure behaviour of the lead-free solder joints in the electronic assemblies are highly dependent on external factors such as the imposed thermal loads, the mechanical vibrations, the effect of aging, etc. Hence, it is essential to understand the reliability and failure of the novel lead-free solder in electronic packaging.

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�diteur: LAP LAMBERT Academic Publishing
Date d'�dition: 2017
Langue: anglais
ISBN 10: 3330046473
ISBN 13: 9783330046474
Reliure: Broch�
Nombre de pages: 144
Coordonn�es du fabricant: non disponible
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Reliability and Failure Analysis of Novel Lead-free Solders

QuangBang Tao

Edit� par LAP LAMBERT Academic Publishing Feb 2017, 2017

ISBN 10 : 3330046473 ISBN 13 : 9783330046474

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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment, developing novel Pb-free solders becomes a real challenge for many industrials in recent years. Mechanical properties of the lead-free alloys are very important factors in the design and reliability evaluation of the soldered joints. Nowadays, among the newly-developed lead-free solder alloys, SAC-Bi,Ni,Sb (InnoLot) alloy, which contains minor quantities of Sb, Bi and Ni, have been identified as promising candidates for the automotive industry. In operation, the microstructure, mechanical response, and failure behaviour of the lead-free solder joints in the electronic assemblies are highly dependent on external factors such as the imposed thermal loads, the mechanical vibrations, the effect of aging, etc. Hence, it is essential to understand the reliability and failure of the novel lead-free solder in electronic packaging. 144 pp. Englisch. N� de r�f. du vendeur 9783330046474

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Reliability and Failure Analysis of Novel Lead-free Solders

QuangBang Tao

Edit� par LAP LAMBERT Academic Publishing, 2017

ISBN 10 : 3330046473 ISBN 13 : 9783330046474

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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Tao QuangBangDr. QUANGBANG TAO, Lecturer at University of Science and Technology, the University of Danang (DUT-UD), Vietnam. He received the Ph.D. degree in mechanical engineering from University of Paris-Saclay, France, in 2016. H. N� de r�f. du vendeur 151234385

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Reliability and Failure Analysis of Novel Lead-free Solders

Quangbang Tao

Edit� par LAP LAMBERT Academic Publishing Feb 2017, 2017

ISBN 10 : 3330046473 ISBN 13 : 9783330046474

Neuf Taschenbuch

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Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne

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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment, developing novel Pb-free solders becomes a real challenge for many industrials in recent years. Mechanical properties of the lead-free alloys are very important factors in the design and reliability evaluation of the soldered joints. Nowadays, among the newly-developed lead-free solder alloys, SAC-Bi,Ni,Sb (InnoLot) alloy, which contains minor quantities of Sb, Bi and Ni, have been identified as promising candidates for the automotive industry. In operation, the microstructure, mechanical response, and failure behaviour of the lead-free solder joints in the electronic assemblies are highly dependent on external factors such as the imposed thermal loads, the mechanical vibrations, the effect of aging, etc. Hence, it is essential to understand the reliability and failure of the novel lead-free solder in electronic packaging.VDM Verlag, Dudweiler Landstra�e 99, 66123 Saarbr�cken 144 pp. Englisch. N� de r�f. du vendeur 9783330046474

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Reliability and Failure Analysis of Novel Lead-free Solders

QuangBang Tao

Edit� par LAP LAMBERT Academic Publishing, 2017

ISBN 10 : 3330046473 ISBN 13 : 9783330046474

Neuf Taschenbuch

impression � la demande

Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne

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Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment, developing novel Pb-free solders becomes a real challenge for many industrials in recent years. Mechanical properties of the lead-free alloys are very important factors in the design and reliability evaluation of the soldered joints. Nowadays, among the newly-developed lead-free solder alloys, SAC-Bi,Ni,Sb (InnoLot) alloy, which contains minor quantities of Sb, Bi and Ni, have been identified as promising candidates for the automotive industry. In operation, the microstructure, mechanical response, and failure behaviour of the lead-free solder joints in the electronic assemblies are highly dependent on external factors such as the imposed thermal loads, the mechanical vibrations, the effect of aging, etc. Hence, it is essential to understand the reliability and failure of the novel lead-free solder in electronic packaging. N� de r�f. du vendeur 9783330046474

Contacter le vendeur