Analysis of Liquid Cooling parameters for Microscale Heat transfer - Couverture souple

Wadhwa, Amandeep Singh; Mittal, Sagar

Couverture souple

ISBN 10 : 3330072423 ISBN 13 : 9783330072428

Editeur : LAP LAMBERT Academic Publishing, 2017

Synopsis

The aim of this work is to study and analyse the parameters of liquids for microscale heat transfer as it is an emerging trend from research point of view. Further the range of coolants for microscale heat transfer can vary from water, ethylene glycol, liquid metal to nanofluids. Heat transfer in microchannel using nanofluid as coolants highly efficient as it has higher heat dissipation capacity than water used as coolant. In present study, the microchannel of rectangular geometry was fabricated by EDM and CuO nanofluid was prepared via wet chemical method. UV-spectroscopy, SEM and DLS were carried out to check the stable dispersion, morphology and size of CuO nanoparticle. Further the CuO nanofluids and water were made to flow through rectangular microchannels and their Reynolds number and Nusselt number were evaluated experimentally and compared. Heat transfer coefficient for CuO and water was determined both theoretically (COMSOL multiphysics software) and experimentally & it was found out that heat transfer coefficient and thermal conductivity of CuO nanofluid is 116% and 40% respectively more than that of water in rectangular microchannel.

Détails de l'édition

• Éditeur: LAP LAMBERT Academic Publishing
• Date d'édition: 2017
• Langue: anglais
• ISBN 10: 3330072423
• ISBN 13: 9783330072428
• Reliure: Broché
• Nombre de pages: 104
• Coordonnées du fabricant: non disponible
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