Articles liés à Signal Integrity In Mother Board - Interconnect Theory...

Signal Integrity In Mother Board - Interconnect Theory and Design - Couverture souple

Packianathan, Rajeswari; Natarajan, Suresh Kumar; Arumugam, Gobinath

 
9783330330931: Signal Integrity In Mother Board - Interconnect Theory and Design
Couverture souple
ISBN 10 : 3330330937 ISBN 13 : 9783330330931
Editeur : LAP Lambert Academic Publishing, 2017

Synopsis

The tremendous growth of wireless technologies and semiconductor technology lead to smaller feature size, higher frequency of operation and faster speed. Therefore more signal lines of circuits or components are placed in a constrained space of printed circuit board. The close proximity of signal lines cause electromagnetic coupling. This electromagnetic coupling leads to signal integrity problems such as crosstalk and crosstalk induced jitter. Signal integrity is a major concern to measure the quality of signal. It can be minimized by the proper design of signal lines or interconnect lines. This book mainly focuses on interconnect design to reduce crosstalk. The analysis and design of this interconnect structure helps to printed circuit board designers and manufacturers for proper function of printed circuit board for high speed applications.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Éditeur
LAP Lambert Academic Publishing
Date d'édition
2017
Langue
anglais
ISBN 10 
3330330937
ISBN 13 
9783330330931
Reliure
Broché
Nombre de pages
72
Coordonnées du fabricant
non disponible
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