Articles liés à 3D and Circuit Integration of MEMS

3D and Circuit Integration of MEMS - Couverture rigide

 
9783527346479: 3D and Circuit Integration of MEMS
Couverture rigide
ISBN 10 : 3527346473 ISBN 13 : 9783527346479
Editeur : Blackwell Verlag GmbH, 2021

Synopsis

3D and Circuit Integration of MEMS

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems

MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration.

You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks.

Readers will also benefit from the inclusion of:

  • A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices
  • An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si
  • Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe
  • A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters

    • Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

    Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

    À propos de l'auteur

    Masayoshi Esashi is senior research fellow in the Micro System Integration Center at Tohoku University and Professor emeritus. He obtained his doctorate from Tohoku University and his research focuses on MEMS, integrated sensors, and MEMS packaging. He has published over 500 scientific papers and was the recipient of the IEEE Jun-ichi Nishizawa Medal in 2016.

    Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

    Éditeur
    Blackwell Verlag GmbH
    Date d'édition
    2021
    Langue
    anglais
    ISBN 10 
    3527346473
    ISBN 13 
    9783527346479
    Reliure
    Relié
    Nombre de pages
    528
    Éditeur
    Esashi Masayoshi
    Coordonnées du fabricant
    non disponible
    Personne responsable
    non disponible