Cutting-edge information about materials, technologies, and mechanisms of printed electronics, and their applications for the smart packaging
Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging.
Written by two highly qualified academics, Printed Electronics for Smart Packaging covers sample topics such as:
A must-have resource for anyone to expand the knowledge of the latest developments for intelligent packaging, Printed Electronics for Smart Packaging is an essential read for not just related academics but also various intersecting industries and professionals due to the importance of packaging in all market sectors.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Wei Wu is full professor and Head of Laboratory of Printable Functional Materials and Printed Electronics, Dean of School of Printing and Packaging, Wuhan University. He received the 15th Bi Shen Award of Printing Technology in 2019, STAM Best Paper Award in 2017 and Hong Kong Scholars Award in 2014.
Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.
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Vendeur : Rheinberg-Buch Andreas Meier eK, Bergisch Gladbach, Allemagne
Buch. Etat : Neu. Neuware -This book provides cutting-edge information about materials, technologies and mechanisms of printed electronics, and their applications for the smart packaging. 320 pp. Englisch. N° de réf. du vendeur 9783527351169
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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Buch. Etat : Neu. Neuware -This book provides cutting-edge information about materials, technologies and mechanisms of printed electronics, and their applications for the smart packaging. 320 pp. Englisch. N° de réf. du vendeur 9783527351169
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Vendeur : Rarewaves.com USA, London, LONDO, Royaume-Uni
Hardback. Etat : New. Cutting-edge information about materials, technologies, and mechanisms of printed electronics, and their applications for the smart packaging Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging. Written by a highly qualified academic, Printed Electronics for Smart Packaging covers sample topics such as: Applications of printed electronics, such as flexible screens, intelligent labels and packaging, interactive books and posters, and even upholsteryMechanisms of smart packaging, printing methods and integrated strategies, and functional inks and substrates for smart packagingPrinted tracks for smart tags and IPES, printed optoelectronic devices and energy suppliers for smart packaging, and printed sensors and indicatorsIntegrated printed electronics systems, and expert outlooks and perspectives on potential future directions for research and development in the field A must-have resource for anyone to expand the knowledge of the latest developments for intelligent packaging, Printed Electronics for Smart Packaging is an essential read for not just related academics but also various intersecting industries and professionals due to the importance of packaging in all market sectors. N° de réf. du vendeur LU-9783527351169
Quantité disponible : Plus de 20 disponibles