Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method - Couverture souple

Lin, Yeong-Jyh; Hwang, Sheng-Jye

 
9783639000344: Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method
Couverture souple
ISBN 10 : 363900034X ISBN 13 : 9783639000344
Editeur : VDM Verlag Dr. Müller, 2008

Synopsis

The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

Biographie de l'auteur

Yeong-Jyh Lin, Ph.D: IC Packaging and computer simultion in Mechanical Engin., National Cheng Kung Univ., R.O.C.Mechanics and research in mechanical design emphasizing computer simulation.Sheng-Jye Hwang, Ph.D: Polymer Processing in Mechanical Engin., Univ. of Illinois, Urbana-Champaign, USAProfessor at Cheng Kung University, R.O.C.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
VDM Verlag Dr. Müller
Date d'édition
2008
Langue
anglais
ISBN 10 
363900034X
ISBN 13 
9783639000344
Reliure
Broché
Nombre de pages
136
Coordonnées du fabricant
non disponible
Personne responsable
non disponible