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Rheology and processing of pastes for electronic packaging materials: Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives - Couverture souple

Durairaj, Rajkumar

 
9783639157468: Rheology and processing of pastes for electronic packaging materials: Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives
Couverture souple
ISBN 10 : 363915746X ISBN 13 : 9783639157468
Editeur : VDM Verlag, 2009

Synopsis

The stencil printing of pastes (solder paste and electrical conductive adhesives) is a very important stage in the assembly of electronic packages. There is wide agreement in industry that the paste printing process accounts for the majority of assembly defects, which originate from poor understanding of the correlation between the paste rheology and the printing process. The development of new pastes formulations is a complex process. As a result more extensive rheological characterisation techniques are required to understand the flow behaviour of the pastes under different shear conditions. This book focuses on the rheological characterisation of pastes and their correlation to the stencil printing process. A general guideline has been developed from the extensive set of results from this research, in particular, on the aspect of correlating key paste performance indicators to the rheological test methods. The book is aimed at paste and electronic manufacturers with an interest of incorporating rheology as a research and quality assurance tool in their formulation and production processes.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

The stencil printing of pastes (solder paste and electrical conductive adhesives) is a very important stage in the assembly of electronic packages. There is wide agreement in industry that the paste printing process accounts for the majority of assembly defects, which originate from poor understanding of the correlation between the paste rheology and the printing process. The development of new pastes formulations is a complex process. As a result more extensive rheological characterisation techniques are required to understand the flow behaviour of the pastes under different shear conditions. This book focuses on the rheological characterisation of pastes and their correlation to the stencil printing process. A general guideline has been developed from the extensive set of results from this research, in particular, on the aspect of correlating key paste performance indicators to the rheological test methods. The book is aimed at paste and electronic manufacturers with an interest of incorporating rheology as a research and quality assurance tool in their formulation and production processes.

Biographie de l'auteur

Dr.Rajkumar Durairaj is Assistant Professor of Mechanical Engineering at the Universiti Tunku Abdul Rahman (UTAR),Malaysia. His research interest is in rheological studies of nano-electronic materials. He is a Member of the Institution of Mechanical Engineers(UK) and a registered Chartered Engineer with the Engineering Council(UK).

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
VDM Verlag
Date d'édition
2009
Langue
anglais
ISBN 10 
363915746X
ISBN 13 
9783639157468
Reliure
Broché
Nombre de pages
120
Coordonnées du fabricant
non disponible
Personne responsable
non disponible