Modeling and Simulation of System In Package: Electro-Thermal Modeling - Couverture souple

Petrushin, Alexey V.

 
9783639259476: Modeling and Simulation of System In Package: Electro-Thermal Modeling
Couverture souple
ISBN 10 : 3639259475 ISBN 13 : 9783639259476
Editeur : VDM Verlag Dr. Müller, 2010

Synopsis

For the robust development of System in Package, increasing of the engineering efficiency and reducing costs, a careful electrical and thermo- mechanical design is found to be vital. The focus of this book is on how to create and simulate effective electrical and thermal models of SiP. The first part is devoted to a new method for I/O buffer simulation, designed on the basis of IBIS methodology and by using VHDL-AMS language. The discussed VHDL-AMS model demonstrates a good performance when compared to the transistor level model. With respect to the IBIS model, an improvement in simulation accuracy of at least 38% is observed. The second part is a presentation of an accurate and efficient thermal model of BGA multi-chip package. This model is sufficiently simple and precise to permit evaluation of the package characteristics in the early phase of design for an optimal SiP design from the thermal point of view. The model was validated by performing simulations with multi-heat sources under various boundary conditions. It was observed that the presented model can predict the junction temperature with an error below 10%, with respect to 3D numerical simulations.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

For the robust development of System in Package, increasing of the engineering efficiency and reducing costs, a careful electrical and thermo- mechanical design is found to be vital. The focus of this book is on how to create and simulate effective electrical and thermal models of SiP. The first part is devoted to a new method for I/O buffer simulation, designed on the basis of IBIS methodology and by using VHDL-AMS language. The discussed VHDL-AMS model demonstrates a good performance when compared to the transistor level model. With respect to the IBIS model, an improvement in simulation accuracy of at least 38% is observed. The second part is a presentation of an accurate and efficient thermal model of BGA multi-chip package. This model is sufficiently simple and precise to permit evaluation of the package characteristics in the early phase of design for an optimal SiP design from the thermal point of view. The model was validated by performing simulations with multi-heat sources under various boundary conditions. It was observed that the presented model can predict the junction temperature with an error below 10%, with respect to 3D numerical simulations.

Biographie de l'auteur

received the Engineer degree from MSTU named after N.E.Bauman, Russia and the Ph.D degree from the Politecnico di Milano, Italy. Research interests: signal integrity issues in high speed circuit design, I/O buffer behavioral modeling and simulation, thermal analysis of electronic devices, process measurement instruments for oil&gas industry.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
VDM Verlag Dr. Müller
Date d'édition
2010
Langue
anglais
ISBN 10 
3639259475
ISBN 13 
9783639259476
Reliure
Broché
Nombre de pages
204
Coordonnées du fabricant
non disponible
Personne responsable
non disponible