Substrate Modeling and Active Substrate Noise Suppression: A Guide to 3D Substrate Modeling and Substrate Noise Suppression in RF/Mixed Signal IC Technology - Couverture souple

Dai, Haitao

Couverture souple

ISBN 10 : 3639262808 ISBN 13 : 9783639262803

Editeur : VDM Verlag Dr. Müller, 2010

Synopsis

As System-on-Chip (SoC) has become more pervasive in recent years, the substrate noise coupling problem has become an increasing challenge in mixed-signal IC design. This book provides a thorough understanding of substrate noise generation mechanisms, 3D substrate modeling, and substrate noise suppression techniques. Furthermore, an active noise suppression technique, developed by the author, is presented in detail, including the theory analysis, 3D substrate and isolation structures modeling, simulation methodology, test site design, and data analysis. At the end, an insightful discussion is provided, helping readers comprehend the advantage, limit, and possible improvement of the technique. This comprehensive book serves as a manual of substrate noise, helping understand substrate noise and helping choose/create effective noise suppression techniques, for RF/mixed signal IC designs.

Détails de l'édition

• Éditeur: VDM Verlag Dr. Müller
• Date d'édition: 2010
• Langue: anglais
• ISBN 10: 3639262808
• ISBN 13: 9783639262803
• Reliure: Broché
• Nombre de pages: 160
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible