Layer Formation and Thermal Performance: Gel Thermal Interfaces and Underfills - Basic Experimental and Modeling Techniques Applied to Contemporary Problems in Electronics Packaging - Couverture souple

Davidson, Drew

 
9783639437034: Layer Formation and Thermal Performance: Gel Thermal Interfaces and Underfills - Basic Experimental and Modeling Techniques Applied to Contemporary Problems in Electronics Packaging
Couverture souple
ISBN 10 : 3639437039 ISBN 13 : 9783639437034
Editeur : AV Akademikerverlag, 2012

Synopsis

Revision with unchanged content. Better understanding of thermal interface materials is needed as today's electronic devices pack more power into less space. The first part of this work is an experimental and theoretical study of a gel thermal interface material with micron-sized alumina particles dispersed in a heat-curing silicone resin. Experimental and theoretical techniques are used to optimize the formation of thin layers by squeezing flow, and for relating layer thermal resistance to layer thickness. The feasibility is assessed of predicting layer thermal resistance as a function of the squeezing flow procedure, the measured bulk effective thermal conductivity, and the measured rheology. The advent of microfluidics is currently arousing greater interest in capillary flows at small length scales. The second part of this work is an experimental and theoretical study of the interface fingering observed in capillary flow of a Newtonian liquid in a corrugated Hele-Shaw cell (a simplified version of the underfill encapsulation of a flip chip device with trace lines). The relationship between interface finger length and channel geometry is explored.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

Revision with unchanged content. Better understanding of thermal interface materials is needed as today's electronic devices pack more power into less space. The first part of this work is an experimental and theoretical study of a gel thermal interface material with micron-sized alumina particles dispersed in a heat-curing silicone resin. Experimental and theoretical techniques are used to optimize the formation of thin layers by squeezing flow, and for relating layer thermal resistance to layer thickness. The feasibility is assessed of predicting layer thermal resistance as a function of the squeezing flow procedure, the measured bulk effective thermal conductivity, and the measured rheology. The advent of microfluidics is currently arousing greater interest in capillary flows at small length scales. The second part of this work is an experimental and theoretical study of the interface fingering observed in capillary flow of a Newtonian liquid in a corrugated Hele-Shaw cell (a simplified version of the underfill encapsulation of a flip chip device with trace lines). The relationship between interface finger length and channel geometry is explored.

Biographie de l'auteur

Drew Davidson's (M.S., Ph.D. Binghamton University) research interests include experimental studies of heat transfer and fluid flow in the packaging of microelectronics. His work has received support from NSF, NIST, and the IEEC at Binghamton University. He is currently a postdoctoral research associate with the CAMM at Binghamton University.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
AV Akademikerverlag
Date d'édition
2012
Langue
anglais
ISBN 10 
3639437039
ISBN 13 
9783639437034
Reliure
Broché
Nombre de pages
292
Coordonnées du fabricant
non disponible
Personne responsable
non disponible

Autres éditions populaires du même titre

9783836461795: Layer Formation and Thermal Performance: Gel Thermal Interfaces and Underfills

Edition présentée

ISBN 10 :  383646179X ISBN 13 :  9783836461795
Editeur : VDM Verlag Dr. Mueller E.K., 2008
Couverture souple