Synopsis
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Présentation de l'éditeur
3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA .
Biographie de l'auteur
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.
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3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme
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3-Dimensional VLSI (Hardcover)
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Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, Berlin, 2010
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Hardcover. Etat : new. Hardcover. "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N° de réf. du vendeur 9783642041563
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3-Dimensional VLSI : A 2.5-Dimensional Integration Scheme
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Springer-Verlag GmbH, 2010
ISBN 10 : 3642041566
ISBN 13 : 9783642041563
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3-Dimensional VLSI
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Springer Berlin Heidelberg, 2010
ISBN 10 : 3642041566
ISBN 13 : 9783642041563
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Gebunden. Etat : New. A new integration scheme considering both performance and yieldNovel cost model to compare difference integration stylesDesign driven approach to prove the performance advantages of 2.5/3-D IC sFull EDA tool support for 3-D layout cr. N° de réf. du vendeur 5044221
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3-Dimensional VLSI: A 2.5-dimensional Integration Scheme
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Hardcover. Etat : Brand New. 200 pages. 9.25x6.00x0.50 inches. In Stock. N° de réf. du vendeur x-3642041566
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3-Dimensional VLSI : A 2.5-Dimensional Integration Scheme
ISBN 10 : 3642041566
ISBN 13 : 9783642041563
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Buch. Etat : Neu. Neuware - '3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme'elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. N° de réf. du vendeur 9783642041563
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