Articles liés à Wafer Bonding: Applications and Technology

Wafer Bonding: Applications and Technology - Couverture souple

Livre 57 sur 233: Springer Series in Materials Science

Alexe, Marin; Gosele, Ulrich

 
9783642059155: Wafer Bonding: Applications and Technology
Couverture souple
ISBN 10 : 3642059155 ISBN 13 : 9783642059155
Editeur : Springer, 2011

Synopsis

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de la quatrième de couverture

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Springer
Date d'édition
2011
Langue
anglais
ISBN 10 
3642059155
ISBN 13 
9783642059155
Reliure
Broché
Nombre de pages
514
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