Technology of Integrated Circuits - Couverture souple

Widmann, D.; Mader, H.; Friedrich, H.

Couverture souple

ISBN 10 : 3642085474 ISBN 13 : 9783642085475

Editeur : Springer, 2010

Synopsis

Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials , modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.

A propos du livre

Présentation de l'éditeur

This is the first book to comprehensively record the authors? authoritative knowledge and practical experience of Ic manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2010
• Langue: anglais
• ISBN 10: 3642085474
• ISBN 13: 9783642085475
• Reliure: Broché
• Nombre de pages: 360
• Coordonnées du fabricant: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Allemagne