Low Dielectric Constant Materials for IC Applications - Couverture souple

Couverture souple

ISBN 10 : 3642632211 ISBN 13 : 9783642632211

Editeur : Springer, 2012

Synopsis

Low dielectric materials are an important component of microelectronic devices. In this carefully edited volume the leading researchers give an introduction to and a survey of the various fields of dielectrics for IC integration. The book appeals to materials reserachers, electrical engineers and advanced students.

A propos du livre

Présentation de l'éditeur

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2012
• Langue: anglais
• ISBN 10: 3642632211
• ISBN 13: 9783642632211
• Reliure: Broché
• Nombre de pages: 334
• Éditeur: Ho Paul S., Leu Jihperng, Lee Wei William
• Coordonnées du fabricant: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Allemagne