Silicon Semiconductor Technology: Processing and Integration of Microelectronic Devices - Couverture souple

Hilleringmann, Ulrich

Couverture souple

ISBN 10 : 3658410426 ISBN 13 : 9783658410421

Editeur : Springer Vieweg, 2023

Synopsis

The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view.

Détails de l'édition

• Éditeur: Springer Vieweg
• Date d'édition: 2023
• ISBN 10: 3658410426
• ISBN 13: 9783658410421
• Reliure: Broché
• Langue: anglais
• Coordonnées du fabricant: non disponible