Heat Transfer Augmentation in a Semiconductor Device - Couverture souple

Bhatt, G. S.

 
9783659472800: Heat Transfer Augmentation in a Semiconductor Device
Couverture souple
ISBN 10 : 3659472808 ISBN 13 : 9783659472800
Editeur : LAP LAMBERT Academic Publishing, 2013

Synopsis

With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10○C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer.

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Présentation de l'éditeur

With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10○C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer.

Biographie de l'auteur

Dr. Bhatt has served some reputed engineering colleges in Bangalore, India, as a faculty over fifteen years. Dr. Bhatt has conducted a few training programs for the engineering faculty. He has published many research papers in reputed journals, and he has been active in the research areas like electronic cooling, heat exchangers, bio-fuels etc..

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
LAP LAMBERT Academic Publishing
Date d'édition
2013
Langue
anglais
ISBN 10 
3659472808
ISBN 13 
9783659472800
Reliure
Broché
Nombre de pages
188
Coordonnées du fabricant
non disponible
Personne responsable
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