Polymer Composites for Microelectronic Applications: Micro-sized Particulate Filled Polymer Composites - Couverture souple

Agrawal, Alok; Satapathy, Alok

 
9783659833366: Polymer Composites for Microelectronic Applications: Micro-sized Particulate Filled Polymer Composites
Couverture souple
ISBN 10 : 3659833363 ISBN 13 : 9783659833366
Editeur : LAP LAMBERT Academic Publishing, 2016

Synopsis

The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc.

Biographie de l'auteur

Dr. Alok Agrawal, an eminent researcher having academic and industrial experience with many research publications to his credit is well known in the field of Composite Materials. Dr.Alok Satapathy, Asso. Prof. of Mechanical Engg. at National Inst. of Technology Rourkela (India) is a leading researcher in the field Composites and Coatings.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
LAP LAMBERT Academic Publishing
Date d'édition
2016
Langue
anglais
ISBN 10 
3659833363
ISBN 13 
9783659833366
Reliure
Broché
Nombre de pages
212
Coordonnées du fabricant
non disponible
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