Proficient Fin Shape for Microprocessor Cooling - Couverture souple

Baviskar, Pankaj; Saner, Kapil; Jadhav, Vijay

 
9783659873652: Proficient Fin Shape for Microprocessor Cooling
Couverture souple
ISBN 10 : 3659873659 ISBN 13 : 9783659873652
Editeur : LAP LAMBERT Academic Publishing, 2016

Synopsis

Microprocessor has become the heart of home/office PC systems. The microprocessor device require electrical energy for their work, the electrical energy is converted into heat energy this may affect the performance of a microprocessor. Heat sink was used to control the temperature of microprocessor in permissible limit. There are various parameters like heat sink material, fin thickness, number of fins, spacing between two fins, base plate thickness and fin shape etc. which affects the performance of heat sink. Material is one of the parameter that increase heat transfer rate. If copper is used in place of aluminium then heat transfer rate increases but at the same time cost also increases. The heat sink base plate thickness is parameter for improvement. When the base plate thickness was increased, the heat sink performed better. However, there are space limitations for every heat sink in a computer. Also the increase in number of fin was not a solution for improving heat transfer. So the fin shape is the parameter which has been studied in this work for better results.

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Présentation de l'éditeur

Microprocessor has become the heart of home/office PC systems. The microprocessor device require electrical energy for their work, the electrical energy is converted into heat energy this may affect the performance of a microprocessor. Heat sink was used to control the temperature of microprocessor in permissible limit. There are various parameters like heat sink material, fin thickness, number of fins, spacing between two fins, base plate thickness and fin shape etc. which affects the performance of heat sink. Material is one of the parameter that increase heat transfer rate. If copper is used in place of aluminium then heat transfer rate increases but at the same time cost also increases. The heat sink base plate thickness is parameter for improvement. When the base plate thickness was increased, the heat sink performed better. However, there are space limitations for every heat sink in a computer. Also the increase in number of fin was not a solution for improving heat transfer. So the fin shape is the parameter which has been studied in this work for better results.

Biographie de l'auteur

Bachelor of Engineering (Mechanical Engineering)Master of Engineering (General Mechanical)Currently Working as a Assistant Professorin Dept. of Mechanical Engineering.(R.C.Patel Institute of technology, Shirpur Maharashtra)Four Papers published,Two conferences,Ten Workshops.Total 6 Years academic experience & 1 year industrial experience.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
LAP LAMBERT Academic Publishing
Date d'édition
2016
Langue
anglais
ISBN 10 
3659873659
ISBN 13 
9783659873652
Reliure
Broché
Nombre de pages
68
Coordonnées du fabricant
non disponible
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