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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry: Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps - Couverture souple
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry
Edité par
LAP LAMBERT Academic Publishing Sep 2016, 2016
ISBN 10 : 3659947482
ISBN 13 : 9783659947483
Neuf
Taschenbuch
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The failure of an electronic circuitry with Aluminum metal process due to electromigration degradation has been a continuous process of research and development in semiconductor industry. With the advent of Internet of Things (IoT) revolution in global semiconductor industry, there is an expected huge demand for analog ICs for healthcare, automotive and other consumer electronic applications. Analog ICs make use of Aluminum metal process as most of the analog applications do not need a state-of-the-art technology. Aluminum is not only cost effective in use but also easy to use in processing as compared to copper. However, Aluminum metal process is prone to electromigration failures. Hence, Electronic chips that make use of Aluminum metal process have to undergo rigorous tests for reliability related failures. When wafer yield becomes low due to electromigration related failures, it results into a huge loss for the semiconductor foundries because of the capital intensive nature of this business. Hence, Semiconductor Industry Professional should be equipped with detail process steps in order to improve the process yield including statistical analysis with Design of Experiments (DoE). 168 pp. Englisch. N° de réf. du vendeur 9783659947483
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry
Edité par
LAP LAMBERT Academic Publishing, 2016
ISBN 10 : 3659947482
ISBN 13 : 9783659947483
Neuf
Couverture souple
Vendeur : moluna, Greven, Allemagne
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Etat : New. N° de réf. du vendeur 511167485
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry : Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
Edité par
LAP LAMBERT Academic Publishing, 2016
ISBN 10 : 3659947482
ISBN 13 : 9783659947483
Neuf
Taschenbuch
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The failure of an electronic circuitry with Aluminum metal process due to electromigration degradation has been a continuous process of research and development in semiconductor industry. With the advent of Internet of Things (IoT) revolution in global semiconductor industry, there is an expected huge demand for analog ICs for healthcare, automotive and other consumer electronic applications. Analog ICs make use of Aluminum metal process as most of the analog applications do not need a state-of-the-art technology. Aluminum is not only cost effective in use but also easy to use in processing as compared to copper. However, Aluminum metal process is prone to electromigration failures. Hence, Electronic chips that make use of Aluminum metal process have to undergo rigorous tests for reliability related failures. When wafer yield becomes low due to electromigration related failures, it results into a huge loss for the semiconductor foundries because of the capital intensive nature of this business. Hence, Semiconductor Industry Professional should be equipped with detail process steps in order to improve the process yield including statistical analysis with Design of Experiments (DoE). N° de réf. du vendeur 9783659947483
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry: Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
Edité par
LAP LAMBERT Academic Publishing, 2016
ISBN 10 : 3659947482
ISBN 13 : 9783659947483
Neuf
Couverture souple
Vendeur : Books Puddle, Woodside, NY, Etats-Unis
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry: Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
Edité par
LAP LAMBERT Academic Publishing, 2016
ISBN 10 : 3659947482
ISBN 13 : 9783659947483
Neuf
Couverture souple
Vendeur : Majestic Books, Hounslow, Royaume-Uni
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Etat : New. Print on Demand. N° de réf. du vendeur 400427791
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry: Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
Edité par
LAP LAMBERT Academic Publishing, 2016
ISBN 10 : 3659947482
ISBN 13 : 9783659947483
Neuf
Couverture souple
Vendeur : Biblios, Frankfurt am main, HESSE, Allemagne
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Etat : New. PRINT ON DEMAND. N° de réf. du vendeur 18396997850
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry | Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
Edité par
LAP LAMBERT Academic Publishing, 2016
ISBN 10 : 3659947482
ISBN 13 : 9783659947483
Neuf
Taschenbuch
Vendeur : preigu, Osnabrück, Allemagne
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Taschenbuch. Etat : Neu. Improving Reliability of Tungsten Plug Via on an Integrated Circuitry | Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps | Apek Mulay | Taschenbuch | Englisch | 2016 | LAP LAMBERT Academic Publishing | EAN 9783659947483 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand. N° de réf. du vendeur 120614586
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry
Edité par
LAP LAMBERT Academic Publishing Sep 2016, 2016
ISBN 10 : 3659947482
ISBN 13 : 9783659947483
Neuf
Taschenbuch
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -The failure of an electronic circuitry with Aluminum metal process due to electromigration degradation has been a continuous process of research and development in semiconductor industry. With the advent of Internet of Things (IoT) revolution in global semiconductor industry, there is an expected huge demand for analog ICs for healthcare, automotive and other consumer electronic applications. Analog ICs make use of Aluminum metal process as most of the analog applications do not need a state-of-the-art technology. Aluminum is not only cost effective in use but also easy to use in processing as compared to copper. However, Aluminum metal process is prone to electromigration failures. Hence, Electronic chips that make use of Aluminum metal process have to undergo rigorous tests for reliability related failures. When wafer yield becomes low due to electromigration related failures, it results into a huge loss for the semiconductor foundries because of the capital intensive nature of this business. Hence, Semiconductor Industry Professional should be equipped with detail process steps in order to improve the process yield including statistical analysis with Design of Experiments (DoE).VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 168 pp. Englisch. N° de réf. du vendeur 9783659947483
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