Analysis of Heat Transfer through Micro Channel: Micro Channel Heat Transfer - Couverture souple

Ghodake, Dattatraya

 
9783659952555: Analysis of Heat Transfer through Micro Channel: Micro Channel Heat Transfer
Couverture souple
ISBN 10 : 3659952559 ISBN 13 : 9783659952555
Editeur : LAP LAMBERT Academic Publishing, 2016

Synopsis

In this work, the focus is on the heat transfer performance of the micro channels with different geometrical configurations. The heat transfer performance is a function of surface area available for the heat transfer and the heat transfer coefficient for the component. In this work, an experimental heat transfer analysis is carried out with copper micro channel heat sinks. Micro channels with four different configurations on the heat sink are fabricated using photo-chemical machining process. The performance analysis is done in the Reynolds Number range of 200 to 1000, with different inlet flow velocities and heat flux values and the experimental analysis emphasis the fact that the geometrical configuration of the channel has a considerable effect on the micro channel heat transfer performance and in turn on the performance of the microelectronic components.

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Présentation de l'éditeur

In this work, the focus is on the heat transfer performance of the micro channels with different geometrical configurations. The heat transfer performance is a function of surface area available for the heat transfer and the heat transfer coefficient for the component. In this work, an experimental heat transfer analysis is carried out with copper micro channel heat sinks. Micro channels with four different configurations on the heat sink are fabricated using photo-chemical machining process. The performance analysis is done in the Reynolds Number range of 200 to 1000, with different inlet flow velocities and heat flux values and the experimental analysis emphasis the fact that the geometrical configuration of the channel has a considerable effect on the micro channel heat transfer performance and in turn on the performance of the microelectronic components.

Biographie de l'auteur

I have completed my M. E. (Heat Power) from Savitribai Phule Pune University, Pune, India in 2016 and also I have completed my B. E. (Mechanical) from Solapur university, Solapur, India in 2012. Currently I am working as Assistant Professor in Mechanical Engineering Department.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
LAP LAMBERT Academic Publishing
Date d'édition
2016
Langue
anglais
ISBN 10 
3659952559
ISBN 13 
9783659952555
Reliure
Broché
Nombre de pages
116
Coordonnées du fabricant
non disponible
Personne responsable
non disponible