The 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 - Couverture rigide

Couverture rigide

ISBN 10 : 3725814473 ISBN 13 : 9783725814473

Editeur : Mdpi AG, 2024

Synopsis

This volume represents the proceedings of the 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023). This conference was organized by Asia University, the Institute of Electrical and Electronics Engineers (IEEE) and the International Institute of Knowledge Innovation and Invention (IIKII), and was held at Asia University, Taichung, Taiwan, on 14-16 April 2023. The conference provided a unified communication platform for researchers on a wide range of topics, such as big data and cloud computing, technologies and applications of artificial intelligence, robotics science and engineering, the Internet of Things and sensor technology, intelligent big data analysis and applications, and other related fields. In recent years, the rapid development of electronic technology and microelectronic technology has fundamentally and universally brought about the new technology revolution. Related research content includes information transmission, information exchange, information processing, signal detection, integrated circuit design and manufacturing, electronic components, microwaves and antenna, instrumentation technology, computer engineering, applications, and others. The analysis and application of big data improve the efficiency of existing products and allow new products to be developed. From relevant engineering fields, 91 excellent papers were selected through peer review for the publication of the proceedings of IEEE ICEIB 2023.

Détails de l'édition

• Éditeur: Mdpi AG
• Date d'édition: 2024
• Langue: anglais
• ISBN 10: 3725814473
• ISBN 13: 9783725814473
• Reliure: Relié
• Nombre de pages: 640
• Éditeur: Meen Teen--Hang, Lin Hsin-Hung, Yang Cheng-Fu
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible