The International Conference on Electronics, Engineering Physics and Earth Science (EEPES 2024) - Couverture rigide

Couverture rigide

ISBN 10 : 3725824134 ISBN 13 : 9783725824137

Editeur : Mdpi AG, 2024

Synopsis

The third edition of the International Conference on Electronics, Engineering Physics and Earth Science (EEPES 2024) was held on a hybrid basis in Kavala, Greece, from 19 to 21 June, 2024. The EEPES Conference is the premier international gathering, organized by the Association CIEES and financial support by EEPES Ltd., both from Bulgaria, which focus on understanding the current state and evolution of the science through the lens of engineering physics, electronic devices and microelectronics, telecommunications, optical and electromagnetic communication, artificial intelligence and soft computing, environmental physics and renewable energy, and many other disciplines. It is a place where researchers, academics, industry representatives, students, and others can present and discuss their progress in research, development, standards, and applications related to applied and engineering physics. The technical program of the conference consists of one plenary session, one technical session, and six in-person and eight online tracks for research papers. The authors of the accepted papers, who were unable to attend the conference in person, were given the option to present their papers online and attend an interactive virtual conference.

Détails de l'édition

• Éditeur: Mdpi AG
• Date d'édition: 2024
• Langue: anglais
• ISBN 10: 3725824134
• ISBN 13: 9783725824137
• Reliure: Relié
• Nombre de pages: 592
• Éditeur: Iliev Teodor, Stoyanov Ivaylo, Mihaylov Grigor
• Coordonnées du fabricant: non disponible
• Personne responsable: gpsr@libri.de; gpsr@libri.de; ; Friedensallee 273; Hamburg; 22763; Allemagne