THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS: PHASE CHANGE MATERIAL BASED HYBRID THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS AND SYSTEMS - Couverture souple

KANDASAMY, RAVI; S. MUJUMDAR, ARUN

 
9783838360874: THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS: PHASE CHANGE MATERIAL BASED HYBRID THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS AND SYSTEMS
Couverture souple
ISBN 10 : 3838360877 ISBN 13 : 9783838360874
Editeur : LAP LAMBERT Academic Publishing, 2010

Synopsis

Thermal design in electronics cooling is to achieve effective heat removal to increase reliability and life of the components and systems. This book focuses on cooling of a Flip Chip (FC) package without the use of phase change materials(PCM). A numerical thermal model was developed and validated. CFD Simulation is performed for PCM and non-PCM based material studies. Relevant thermal performance data were obtained to show the effects of thermal interface material, lid, heat sink and process variables. Excellent agreement found between the numerical and the measured data. A novel PCM-based passive thermal control of electronic devices was investigated experimentally. A tall enclosure with uniform/discrete heat sources applied on sides for PCM melting and another with a PCM-filled heat sink setup developed and tested. PCM-based cooling technique is attractive thermal concept for transient applications. Effects of various parameters on melting/freezing times were studied. Flow visualization experiments were also made to determine the PCM melting rates. Finally, a 2D numerical study was conducted to compare simulation results with experimental data.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

Thermal design in electronics cooling is to achieve effective heat removal to increase reliability and life of the components and systems. This book focuses on cooling of a Flip Chip (FC) package without the use of phase change materials(PCM). A numerical thermal model was developed and validated. CFD Simulation is performed for PCM and non-PCM based material studies. Relevant thermal performance data were obtained to show the effects of thermal interface material, lid, heat sink and process variables. Excellent agreement found between the numerical and the measured data. A novel PCM-based passive thermal control of electronic devices was investigated experimentally. A tall enclosure with uniform/discrete heat sources applied on sides for PCM melting and another with a PCM-filled heat sink setup developed and tested. PCM-based cooling technique is attractive thermal concept for transient applications. Effects of various parameters on melting/freezing times were studied. Flow visualization experiments were also made to determine the PCM melting rates. Finally, a 2D numerical study was conducted to compare simulation results with experimental data.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
LAP LAMBERT Academic Publishing
Date d'édition
2010
Langue
anglais
ISBN 10 
3838360877
ISBN 13 
9783838360874
Reliure
Broché
Nombre de pages
152
Coordonnées du fabricant
non disponible
Personne responsable
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