Mixed-Domain Simulation and Wafer-Level Packaging of RF-MEMS Devices: An Itinerary through Two Key-Issues for the Successful Exploitation of RF-MEMS Technology - Couverture souple

Iannacci, Jacopo; Gaddi, Roberto

 
9783838364216: Mixed-Domain Simulation and Wafer-Level Packaging of RF-MEMS Devices: An Itinerary through Two Key-Issues for the Successful Exploitation of RF-MEMS Technology
Couverture souple
ISBN 10 : 383836421X ISBN 13 : 9783838364216
Editeur : LAP LAMBERT Academic Publishing, 2010

Synopsis

The exploitation of MicroElectroMechanical-Systems for Radio Frequency applications (RF-MEMS) has been attracting the interest of the Scientific Community through the past decade, because of its potentialities in terms of high-performance and large reconfigurability it can enable in transceiver platform (e.g. in satellites, radars, mobile phones). This work addresses two critical issues leading to the successful exploitation of RF-MEMS technology, namely the modeling of their multi-physical behaviour (electromechanical and electromagnetic) and the packaging/encapsulation of such devices to enable their operability and integration with standard technologies. The first issue is addressed with the development of MEMS behavioural compact models, allowing fast and accurate simulations within commercial IC development frameworks. The packaging issue is treated by discussing several technology solutions and focusing on the Wafer-Level-Packaging approach. This book provides the reader with useful and practical information on the modeling, simulation and integration of RF-MEMS, and it is particularly suitable for Scientists, Researchers, Designers and Technologists in the RF-MEMS field.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

The exploitation of MicroElectroMechanical-Systems for Radio Frequency applications (RF-MEMS) has been attracting the interest of the Scientific Community through the past decade, because of its potentialities in terms of high-performance and large reconfigurability it can enable in transceiver platform (e.g. in satellites, radars, mobile phones). This work addresses two critical issues leading to the successful exploitation of RF-MEMS technology, namely the modeling of their multi-physical behaviour (electromechanical and electromagnetic) and the packaging/encapsulation of such devices to enable their operability and integration with standard technologies. The first issue is addressed with the development of MEMS behavioural compact models, allowing fast and accurate simulations within commercial IC development frameworks. The packaging issue is treated by discussing several technology solutions and focusing on the Wafer-Level-Packaging approach. This book provides the reader with useful and practical information on the modeling, simulation and integration of RF-MEMS, and it is particularly suitable for Scientists, Researchers, Designers and Technologists in the RF-MEMS field.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
LAP LAMBERT Academic Publishing
Date d'édition
2010
Langue
anglais
ISBN 10 
383836421X
ISBN 13 
9783838364216
Reliure
Broché
Nombre de pages
292
Coordonnées du fabricant
non disponible
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