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Plasma-processing-induced Damage Of Thin Dielectric Films - Couverture souple

Ren, He

 
9783843387583: Plasma-processing-induced Damage Of Thin Dielectric Films
Couverture souple
ISBN 10 : 3843387583 ISBN 13 : 9783843387583
Editeur : LAP LAMBERT Academic Publishing, 2012

Synopsis

In semiconductor industry, material property degradation due to process is a critical factor that limits the device performance. Process-induced damage on a variety of dielectric materials is discussed and measured. Results from various metrologies are packaged and correlated into systematic theory. Charge-induced, chemical, and physical damage source in plasma process environment is identified and optimized. Two sample types of dielectrics are investigated: high-k dielectrics used in device technology and low-k dielectrics as observed in interconnect technology.

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À propos de l'auteur

He Ren received Ph.D degree in electrical engineering from University of Wisconsin, Madison, in 2011. He is currently working at Applied Materials, Inc. His research interests include electromagnetics, plasma diagnostics, and semiconductor design and fabrication. This book is 2012 Harold A. Peterson Award winner of ECE, UW-Madison.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
LAP LAMBERT Academic Publishing
Date d'édition
2012
Langue
anglais
ISBN 10 
3843387583
ISBN 13 
9783843387583
Reliure
Broché
Nombre de pages
188
Coordonnées du fabricant
non disponible
Personne responsable
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