Investigation of Triple Line Energy in Copper with Atomic Force Microscopy - Couverture souple

Zhao, Bingbing

9783869559469: Investigation of Triple Line Energy in Copper with Atomic Force Microscopy

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ISBN 10 : 3869559462 ISBN 13 : 9783869559469

Editeur : Cuvillier Verlag, 2011

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�diteur: Cuvillier Verlag
Date d'�dition: 2011
Langue: anglais
ISBN 10: 3869559462
ISBN 13: 9783869559469
Reliure: Broch�
Nombre de pages: 118
Coordonn�es du fabricant: non disponible
Personne responsable: non disponible

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Investigation of Triple Line Energy in Copper with Atomic Force Microscopy

Bingbing Zhao

Edit� par Cuvillier Nov 2011, 2011

ISBN 10 : 3869559462 ISBN 13 : 9783869559469

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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -In this study, the grain boundary-free surface line tension and grain boundary triple line tension were investigated on copper polycrystals, nanowires, and tricrystals through a thermodynamically correct approach which allows a direct and precise measurement of the line tension. The grain boundary-free surface line tension was determined by comparing the dihedral angle at the root of a flat and a curved grain boundary groove. A measurement of grain boundary triple line tension was achieved by the investigation of the force equilibrium at a triple junction as established by the inclination of the adjourning grain boundary grooves at the root of the triple junction. The experimental technique utilized atomic force microscopy (AFM) to scan the surface topography of grain boundary thermal grooves and triple junctions.The mean value of the dihedral angle on a flat grain boundary groove in copper polycrystals was 161.8�, with a scatter of 2.3�. Assuming a surface energy of 1.75J/m2, the corresponding grain boundary energy was about 0.6J/m2. The grain boundary energies of a low angle grain boundary (9.4� 118 pp. Englisch. N� de r�f. du vendeur 9783869559469

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Investigation of Triple Line Energy in Copper with Atomic Force Microscopy

Bingbing Zhao

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ISBN 10 : 3869559462 ISBN 13 : 9783869559469

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Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - In this study, the grain boundary-free surface line tension and grain boundary triple line tension were investigated on copper polycrystals, nanowires, and tricrystals through a thermodynamically correct approach which allows a direct and precise measurement of the line tension. The grain boundary-free surface line tension was determined by comparing the dihedral angle at the root of a flat and a curved grain boundary groove. A measurement of grain boundary triple line tension was achieved by the investigation of the force equilibrium at a triple junction as established by the inclination of the adjourning grain boundary grooves at the root of the triple junction. The experimental technique utilized atomic force microscopy (AFM) to scan the surface topography of grain boundary thermal grooves and triple junctions.The mean value of the dihedral angle on a flat grain boundary groove in copper polycrystals was 161.8�, with a scatter of 2.3�. Assuming a surface energy of 1.75J/m2, the corresponding grain boundary energy was about 0.6J/m2. The grain boundary energies of a low angle grain boundary (9.4�. N� de r�f. du vendeur 9783869559469

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Investigation of Triple Line Energy in Copper with Atomic Force Microscopy

Zhao, Bingbing

Edit� par Jentzsch-Cuvillier, Annette, 2011

ISBN 10 : 3869559462 ISBN 13 : 9783869559469

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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. KlappentextrnrnIn this study, the grain boundary-free surface line tension and grain boundary triple line tension were investigated on copper polycrystals, nanowires, and tricrystals through a thermodynamically correct approach which allows a di. N� de r�f. du vendeur 70373939

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Investigation of Triple Line Energy in Copper with Atomic Force Microscopy

Bingbing Zhao

Edit� par Cuvillier, Cuvillier Nov 2011, 2011

ISBN 10 : 3869559462 ISBN 13 : 9783869559469

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Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne

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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -In this study, the grain boundary-free surface line tension and grain boundary triple line tension were investigated on copper polycrystals, nanowires, and tricrystals through a thermodynamically correct approach which allows a direct and precise measurement of the line tension. The grain boundary-free surface line tension was determined by comparing the dihedral angle at the root of a flat and a curved grain boundary groove. A measurement of grain boundary triple line tension was achieved by the investigation of the force equilibrium at a triple junction as established by the inclination of the adjourning grain boundary grooves at the root of the triple junction. The experimental technique utilized atomic force microscopy (AFM) to scan the surface topography of grain boundary thermal grooves and triple junctions.The mean value of the dihedral angle on a flat grain boundary groove in copper polycrystals was 161.8�, with a scatter of 2.3�. Assuming a surface energy of 1.75J/m2, the corresponding grain boundary energy was about 0.6J/m2. The grain boundary energies of a low angle grain boundary (9.4�Cuvillier Verlag, Nonnenstieg 8, 37075 G�ttingen 118 pp. Englisch. N� de r�f. du vendeur 9783869559469

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