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The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Vendeur : Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Allemagne
Paperback. Etat : Wie neu. 1st ed. 412 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 825. N° de réf. du vendeur 816394
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Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
Paperback. Etat : Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book. N° de réf. du vendeur ERICA75839084516476
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