Computational Heat Transfer Analysis of Electronic Equipments: Using Finite Element Analysis Approach - Couverture souple

Sharma, Sahil; Mehta, Nirajkumar; Mandalia, Jay

 
9786138836193: Computational Heat Transfer Analysis of Electronic Equipments: Using Finite Element Analysis Approach
Couverture souple
ISBN 10 : 6138836197 ISBN 13 : 9786138836193
Editeur : Scholars' Press, 2019

Synopsis

Due to rapid research in the electronics industry, including a dramatic increase in chip densities and power densities, as well as a continuous decrease in physical dimensions of electronic packages, thermal management is, and will continue to be, one of the most critical areas in electronic product development. It will have a significant impact on the cost, overall design, reliability and performance. The present trend in the electronics industry is to reduce the size and increase the performance of the equipment. The cooling rate of the modern electronic component is one of the prime areas for the application of thermal control techniques. In the present book, the effect of various shapes of cross sections of fins on the motherboard is studied keeping the inlet air velocity, the temperature of the ambient and the heat generation constant. Finite Element Analysis is done to get heat transfer and temperature distribution. This book will be useful for researchers doing research on computational heat transfer specifically for the electronics industry.

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Éditeur
Scholars' Press
Date d'édition
2019
Langue
anglais
ISBN 10 
6138836197
ISBN 13 
9786138836193
Reliure
Broché
Nombre de pages
60
Coordonnées du fabricant
non disponible
Personne responsable
non disponible