Grain Structures & Effects of Stress on Grain Boundaries - Couverture souple

Sharma, Manvinder; Khosla, Dishant; Singh, Sohni

 
9786139877874: Grain Structures & Effects of Stress on Grain Boundaries
Couverture souple
ISBN 10 : 6139877873 ISBN 13 : 9786139877874
Editeur : LAP LAMBERT Academic Publishing, 2018

Synopsis

Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.

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Éditeur
LAP LAMBERT Academic Publishing
Date d'édition
2018
Langue
anglais
ISBN 10 
6139877873
ISBN 13 
9786139877874
Reliure
Broché
Nombre de pages
68
Coordonnées du fabricant
non disponible
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