Investigations On Performance Evaluation Of CMOS VLSI - Couverture souple

Thangarajan, Sheela; Thangavelu, Muthumanickam

Couverture souple

ISBN 10 : 6139994446 ISBN 13 : 9786139994441

Editeur : LAP LAMBERT Academic Publishing, 2019

Synopsis

The progression in very large scale integration, billions of transistors and components can be placed on a single semiconductor chip for implementation of complex circuitry. The growth in recent technology is towards miniaturization of semiconductor devices, which have several noticeable hindrances in heat dissipation, power utility, chip area and efficiency of the devices. As the technology advances more into deep submicron level, feature sizes, power dissipation due to leakage current are increasing at an alarming rate. Numerous projections show that leakage power will develop into analogous to dynamic power dissipation in coming years; however dynamic power is also increasing and still dominates. The optimal solution for solving these hindrances is to analyze the performance of VLSI circuit designed using different CMOS technologies.

Détails de l'édition

• Éditeur: LAP LAMBERT Academic Publishing
• Date d'édition: 2019
• Langue: anglais
• ISBN 10: 6139994446
• ISBN 13: 9786139994441
• Reliure: Broché
• Nombre de pages: 176
• Coordonnées du fabricant: non disponible
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